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Pneumatic drive bellows pumps

Resolution improvement

The resolution of the CFD-1T-B has been greatly improved compared to our existing models. The minimum flow of 1mL/shot offers greater accuracy in chemical condensation control that is required in the wafer cleaning process. The CFD-1T-B always feeds the correct quantity of chemical without overshoot, eliminating excess liquid wastage. In addition, the anti-siphon mechanism prevents unintentional siphoning.

Corrosion resistant wet ends

Fluoroplastic wet ends (PTFE, PFA, PCTFE) is capable of handling the strong acids, alkalines and hydrogen peroxide required for semiconductor processing. PTFE, PFA, PP, PVC external parts and PTFE coated screws provide additional protection against chemical attack.

Flow rate adjustment

Simply open the bottom cover to easily adjust stroke length to give between 1.0-2.7ml/shot. (Factory default is 1.0ml/shot)

Leak sensor

Every unit is equipped with a leakage sensor to detect any leakage immediately.

Max. stroke speed30 spm
Max. discharge pressure 0.05 MPa
Main materialsPTFE, PFA, PCTFE
Liquid temp. range20 to 60 C deg
Discharge capacity1 mL/shot